Individual Case Study Due Week 7: This Case Study Looks At T

Individual Case Study Due Week 7this Case Study Looks At The Behavio

This case study looks at the behavior of a circuit board process through the use of control charts. At least two control charts will need to be constructed, and from them, you will be asked to provide an assessment of what you see. A template to facilitate the construction of the control charts has been provided. You are not required to use this template; however, it will greatly facilitate the solution.

Fujiyama Electronics Inc. has had difficulties with circuit boards purchased from an outside supplier. Unacceptable variability occurs between two drilled holes that are supposed to be 5 cm apart on the circuit boards. Thirty samples of four boards each were taken from shipments from the supplier. The data obtained can be found on a worksheet in Files: “Fujiyama_Electronics_Sample_Data.xlsx”.

The student will submit the completed case study in a Word document – Due Week 7. The students will complete and answer the following questions:

  • Calculate X-bar-bar, R-bar, and associated control limits using the data in the table above.
  • Create x̄ and R control charts from the data in the table above.
  • Discuss notable out-of-control conditions displayed in the completed control charts. Only consider points outside the control limits.
  • If these conditions could be defined as assignable causes and are removed from the process, what will happen to the control charts?
  • Remove data related to out-of-control points, recalculate new control limits, and create updated control charts. Discuss the differences between the original and revised control charts and what has changed.

The format of the case study should conform to APA guidelines for the title page and text. Include all graphics and charts within the Word document, and ensure citations and references follow APA style guidelines.

Paper For Above instruction

The analysis of process variability in manufacturing is essential for maintaining product quality and consistency. In this case, the focus is on a circuit board manufacturing process at Fujiyama Electronics Inc., where variability issues have been identified between two drilled holes intended to be 5 centimeters apart. The goal of this study is to evaluate process stability through control charts, identify out-of-control conditions, and assess the impact of removing assignable causes from the process. This comprehensive analysis follows statistical process control (SPC) principles, utilizing control charts to visualize and interpret process behavior.

Data collection is fundamental to process analysis. In this scenario, thirty samples, each containing four circuit boards, were analyzed. The measurements centered on the distance between two drilled holes, with the aim of verifying if the process remains within acceptable limits. The available data in the provided Excel file serve as the basis for the calculations and control chart construction. The first step involves calculating the overall mean (X̄̄) and average range (R̄), which will then facilitate the establishment of control limits for the X̄ and R charts.

Calculating X̄̄, R̄, and Control Limits

The grand mean (X̄̄) is computed by averaging all individual sample means, while the average range (R̄) is derived from the average of the ranges within each sample. Using standard formulas:

  • X̄̄ = (Sum of all sample means) / number of samples.
  • R̄ = (Sum of all ranges) / number of samples.
  • Control limits for the X̄ chart are then set at X̄̄ ± A2 * R̄, where A2 is a constant based on sample size.
  • Control limits for the R chart are R̄ ± D4 R̄ and R̄ ± D3 R̄, with D3 and D4 as constants.

These calculations enable the visualization of process variability and stability, highlighting points that fall outside control limits, indicative of potential assignable causes.

Constructing Control Charts and Identifying Out-of-Control Conditions

Using the computed control limits, X̄ and R charts are plotted. Out-of-control points are identified by their position outside the control limits. According to SPC guidelines, such points suggest that the process may be affected by special causes that need investigation. In this analysis, only points beyond control limits are considered, disregarding runs or proximity zones.

For instance, if multiple points on the X̄ chart are above the upper control limit, this indicates a shift in the process mean, possibly due to an external disturbance. Similarly, outliers on the R chart suggest increased variability that warrants investigation.

Assessing the Impact of Removing Out-of-Control Points

If the out-of-control points are caused by specific assignable factors and are removed, the process can be stabilized. The recalculated control limits should reflect a more consistent process. By removing these points and reconstructing the control charts, the differences in the charts reveal the extent of process improvement.

Typically, the updated control charts will show fewer points outside the limits, increased process stability, and narrower control limits, indicating reduced variability. This demonstrates how identifying and eliminating specific causes of variation can enhance process control.

Discussion and Conclusion

The analysis underscores the importance of control charts in monitoring and controlling manufacturing processes. Identifying out-of-control points allows for targeted investigations into process anomalies. Removing these points and recalculating control limits underscores the potential to improve process stability when assignable causes are addressed.

Therefore, implementing a robust SPC system enables continuous process improvement, reducing variability, and ensuring product quality. At Fujiyama Electronics, applying these principles can address the observed variability issues with the circuit boards, leading to more consistent and reliable productions.

References

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