This Case Study Looks At The Behavior Of A Circuit Board Pro
This case study looks at the behavior of a circuit board process through the use of control charts
This case study examines the behavior of a circuit board manufacturing process by utilizing control charts. The objective is to analyze variability in the process, identify any out-of-control conditions, and assess the effects of removing assignable causes. Data have been collected from 30 samples, each consisting of four circuit boards, focusing on the distance between two drilled holes intended to be 5 cm apart. The analysis involves calculating control chart statistics, constructing control charts, interpreting out-of-control signals, and evaluating the process stability before and after addressing identified issues.
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In the realm of manufacturing quality control, process stability is critical to ensure consistent product quality. Control charts serve as essential tools for monitoring process behavior over time, enabling the identification of assignable causes of variation. This case study investigates such variability in a circuit board production process at Fujiyama Electronics Inc., where the primary concern is the inconsistency in the spacing between drilled holes, intended to be 5 centimeters apart. The analysis hinges on creating and interpreting control charts based on collected data, identifying out-of-control points, and evaluating the impact of removing these anomalies on the overall process stability.
Initially, the calculation of overall process control statistics is necessary. The dataset comprises 30 samples, each with four measurements of hole separation distances. From this data, the grand mean (X̄̄) and the average range (R̄) are computed to establish control limits. The grand mean is obtained by averaging all individual sample means, while R̄ is the mean of all sample ranges. The control limits are derived using standard formulas: the upper control limit (UCL) and lower control limit (LCL) for both X̄ and R charts, incorporating factors from control chart coefficient tables. Specifically, the formulas are:
- X̄ chart: UCL and LCL are calculated as X̄̄ ± A2 * R̄
- R chart: UCL and LCL are R̄ ± D4 R̄ or R̄ ± D3 R̄, depending on the limits
where A2, D3, and D4 are constants based on subgroup size.
Subsequently, the control charts are constructed by plotting individual sample means (X̄) and ranges (R) against their respective control limits. The analysis focuses on detecting out-of-control points, characterized by data points falling outside the control limits. In this case, several points on both charts are identified as out-of-control, indicating the presence of assignable causes of variation that warrant further investigation.
Understanding the nature of these outliers is crucial to maintain process stability. Notably, the out-of-control conditions suggest that specific factors, such as drill bit wear, machine misalignment, or material inconsistencies, may be influencing the hole placement. Recognizing these factors supports targeted corrective actions aimed at restoring the process to a state of statistical control.
Once these out-of-control points are identified, the next step is to consider the process adjustments. If the causes of variation are deemed assignable and are effectively removed, the process is expected to become more stable. This change should be reflected in the control charts by a reduction in variability and the elimination of outliers. To evaluate this effect quantitatively, the data points associated with out-of-control signals are removed, and the calculation of new summary statistics—X̄̄ and R̄—and control limits is undertaken.
New control charts are then created based on this updated data set. The expectation is that these charts will demonstrate fewer or no out-of-control points, indicating a stabilized process. The comparison between the original and revised control charts reveals the impact of corrective measures, typically showing improved process capability and consistency. The overall effect is a process that conforms more closely to specifications, reducing defect rates and improving quality assurance.
The findings from this analysis emphasize the importance of continual process monitoring. The initial control charts identified specific points deviating from control limits, highlighting areas requiring intervention. Post-correction, the strengthened stability of the process, reflected through more consistent control charts, underscores the value of systematic quality control practices. Maintaining such control ensures the production of circuit boards with precise hole spacing, fulfilling quality standards and customer expectations.
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